Conference

»

Next-Generation Data Center Optical Interconnect Technology Evolution Forum (Finished)

7 March 2024 15:30 - 17:30

Conference Room, B2

Organizers

Informa Markets

Asia Photonics Expo(APE)

Yole Group

Co-organizer

Photonics Society of Chinese Heritage (PSC)

Background

Nowadays, the global demand for connectivity and computing power has doubled, resulting in a significant increase in the construction of data centers. With the rapid development of AI large-scale model cluster training, 800G optical modules have entered mass production and are competing in terms of supply capacity. The increasing demand for data bandwidth will accelerate the evolution of optical modules from 800G to 1.6T. At the 1.6T rate, the integration and power consumption issues of traditional pluggable optical modules will become more prominent. Low power consumption and miniaturization are key demands for 1.6T optical modules. Linear drive pluggable solutions have also become a hot topic in the industry. Whether to choose LPO or CPO in the future remains to be discussed in the industry. However, it is certain that remove DSP signal is becoming more apparent and will lead the innovation technologies for enterprises in optical module, and optoelectronic chip. As data centers expand and upgrade due to diversified business development, traditional data centers are gradually moving towards the direction of constructing intelligent computing centers. This poses higher requirements for high-speed transmission technologies in data centers at the network level, server, and switch equipment capacity level, as well as chip and module levels.

“Next-Generation Data Center Optical Interconnect Technology Evolution Forum” will be held on March 7, 2024. We will join hands with globally renowned Internet service providers, data center equipment manufacturers and core module device manufacturers and other industry experts to focus on the future development trend of high-speed data center transmission network interconnect in the era of AI large computing power.

Agenda

Next-Generation Data Center Optical Interconnect Technology Evolution Forum
Time Topics Speakers
Host: Ying Huang, Co-founders, Rain Tree Photonics Pte. Ltd.
15:30-15:35

Opening

Ying Huang, Co-founders, Rain Tree Photonics Pte. Ltd.

15:35-15:55

Global Perspectives on the Key Photonics Technologies Enabling Terabit Capacities of Optical Interconnects

Martin Vallo, PhD - Senior Technology & Market Analyst, Photonics at Yole Group

15:55-16:15

Hybrid-Integration Platform for Next Generation Optical Interconnects

Jinyu Mo, SVP/GM of Asia, POET Technologies

16:15-16:35

Silicon Photonics Foundries: Perspective from the Users and Perspective from the Providers in the Era of AI/ML

Patrick Lo, CTO, Advanced Micro-Foundry Pte. Ltd.

16:35-16:55

Optics Component Wet Alignment Algorithm to Improve the Misalignment Impacted by Epoxy Damping Effect

Waiyapot Suttawassuntorn, Technical Lead, Intel

16:55-17:15

The Future of Photonic Compound Semiconductor Substrates for Optical Interconnects in Datacenters

Ali Jaffal, PhD - Technology & Market Analyst, Semiconductor Substrates & Materials at Yole Group

 

Speakers

Martin VALLO

PhD - Senior Technology & Market Analyst, Photonics at Yole Group

Jinyu Mo

SVP/GM of Asia, POET Technologies

Patrick Lo

CTO, Advanced Micro-Foundry Pte Ltd.

Waiyapot Suttawassuntorn

Technical Lead, Intel

Ali JAFFAL

PhD - Technology & Market Analyst, Semiconductor Substrates & Materials at Yole Group

*In no particular order

Contact

Speaking and Sponsorship opportunities, please contact:
Janice Zeng
TEL:86-755-88242484
E-mail:Janice.Zeng@informa.com